LNP THERMOCOMP Lexan_EXCP0022
應用范圍： 產品描述 LNP THERMOCOMP Lexan_EXCP0022物性表 LNP* Thermocomp* Lexan_EXCP0022 compound is a 11% carbon fiber filled PC injection moulding resin. Material identification acc. ISO11469: >PC-CF11<
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產品描述
LNP THERMOCOMP Lexan_EXCP0022物性表
LNP* Thermocomp* Lexan_EXCP0022 compound is a 11% carbon fiber filled PC injection moulding resin. Material identification acc. ISO11469: >PC-CF11<
來源：http://www.i351.cn/product827919.html
發布時間：2022/5/9 11:43:06
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