LNP Thermocomp RC008ESS
搴旂敤鑼冨洿錛氥��銆�浜у搧鎻忚堪銆�銆�LNP Thermocomp RC008ESS鐗╂�ц〃銆�銆�鈥淟NP THERMOCOMP RC008ESS鏄竴縐嶈仛閰拌兒66錛堝凹榫?6錛夋潗鏂?鍚湁鐨勫～鍏呯墿涓虹⒊綰ょ淮澧炲己鏉愭枡,鍔犲伐鏂瑰紡涓?娉ㄥ皠鎴愬瀷銆傘��銆�LNP THERMOCOMP RC008ESS鐨勪富瑕佺壒鎬ф湁:銆�銆�閫氳繃ROHS璁よ瘉鈥濄��銆�LNP* THERMOCOMP* RC008ESS is a compound based on PA6
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銆�銆�浜у搧鎻忚堪
銆�銆�LNP Thermocomp RC008ESS鐗╂�ц〃
銆�銆�鈥?a href="/pro1type109373.html" target="_blank">LNP THERMOCOMP RC008ESS鏄竴縐嶈仛閰拌兒66錛堝凹榫?6錛夋潗鏂?鍚湁鐨勫～鍏呯墿涓虹⒊綰ょ淮澧炲己鏉愭枡,鍔犲伐鏂瑰紡涓?娉ㄥ皠鎴愬瀷銆?/div>
銆�銆�LNP THERMOCOMP RC008ESS鐨勪富瑕佺壒鎬ф湁:
銆�銆�閫氳繃ROHS璁よ瘉鈥?/div>
銆�銆�LNP* THERMOCOMP* RC008ESS is a compound based on PA66 resin containing Carbon Fiber. Added features include; Electrically Conductive, Easy Molding, Heat Stabilized.
銆�銆�Property/鐗規�?/div>
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鍙戝竷鏃墮棿錛?022/5/10 9:20:15
涓婁竴涓細LNP Thermocomp RC008
涓嬩竴涓細LEXAN PC LI1813R
