LNP THERMOCOMP EC006PXQ
搴旂敤鑼冨洿錛氥銆浜у搧鎻忚堪銆銆LNP THERMOCOMP EC006PXQ鐗╂ц〃銆銆30%紕崇氦緇村寮烘潗鏂欙紝LNP THERMOCOMP EC006PXQ is a compound based on Polyetherimide containing 30% Carbon FIber. Added features include: Electrically Conductive, Easy Molding.
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銆銆浜у搧鎻忚堪
銆銆LNP THERMOCOMP EC006PXQ鐗╂ц〃
銆銆30%紕崇氦緇村寮烘潗鏂欙紝LNP THERMOCOMP EC006PXQ is a compound based on Polyetherimide containing 30% Carbon FIber. Added features include: Electrically Conductive, Easy Molding.
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