LNP THERMOCOMP Lexan_EXCP0008
搴旂敤鑼冨洿錛氥銆浜у搧鎻忚堪銆銆LNP THERMOCOMP Lexan_EXCP0008鐗╂ц〃銆銆LNP* Thermocomp* Lexan_EXCP0008 compound is a 20% glass beads filled PC injection moulding resin
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銆銆浜у搧鎻忚堪
銆銆LNP THERMOCOMP Lexan_EXCP0008鐗╂ц〃
銆銆LNP* Thermocomp* Lexan_EXCP0008 compound is a 20% glass beads filled PC injection moulding resin
鐩稿叧鏍囩錛?a href='/product.html?key=LNP THERMOCOMP Other'>LNP THERMOCOMP Other,LNP THERMOCOMP Lexan_EXCP0008,
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涓婁竴涓細(xì)LEXAN PC FXM911A
涓嬩竴涓細(xì)LNP THERMOCOMP Lexan_EXCP0011