LNP THERMOCOMP Lexan_EXCP0011
搴旂敤鑼冨洿錛氥銆浜у搧鎻忚堪銆銆LNP THERMOCOMP Lexan_EXCP0011SF008鐗╂ц〃銆銆LNP* Thermocomp* Lexan_EXCP0011 compound is a 15% carbon fiber filled PC injection moulding resin. Material identification acc. ISO11469: >PC-CF15<
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銆銆LNP THERMOCOMP Lexan_EXCP0011SF008鐗╂ц〃
銆銆LNP* Thermocomp* Lexan_EXCP0011 compound is a 15% carbon fiber filled PC injection moulding resin. Material identification acc. ISO11469: >PC-CF15<

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涓婁竴涓細LNP THERMOCOMP Lexan_EXCP0008
涓嬩竴涓細LEXAN PC FXM921A